Capabilities / Capacity

6 SMT lines with total capacity of 70 million mounting point per month.
Solder Paste printing and adhesive bond Dispensing capabilities.
High Precision Fine Pitch I.C, QFP, BGA and CSP mounting enabled.
Fine pitch placement up to 0201 (0603) chips.
Lead-free soldering process.
Wave soldering process.
Manual assembly line. (4 Lines)
Engineering & Prototype build.
Complete Box Build.
Complete function test.
One stop Solution.